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micropower low dropout voltage regulators z suffix plastic package case 29 (to226aa/to92) 2 3 18 7 6 5 2 3 4 (top view) output sense shutdown input feedback error output d suffix plastic package case 751 (so8) 8 1 n suffix plastic package case 626 8 1 1 pin: 1. output 2. ground 3. input v o tap gnd dt suffix plastic package case 369a (dpak) 3 1 heatsink surface (shown as terminal 4 in case outline drawing) is connected to pin 2. 123 (top view) pin: 1. input 2. ground 3. output dm suffix plastic package case 846a (micro8) 8 1 3150 motorola analog ic device data
the lp2950 and lp2951 are micropower voltage regulators that are specifically designed to maintain proper regulation with an extremely low inputtooutput voltage differential. these devices feature a very low quiescent bias current of 75 m a and are capable of supplying output currents in excess of 100 ma. internal current and thermal limiting protection is provided. the lp2951 has three additional features. the first is the error output that can be used to signal external circuitry of an out of regulation condition, or as a microprocessor poweron reset. the second feature allows the output voltage to be preset to 5.0 v, 3.3 v or 3.0 v output (depending on the version) or programmed from 1.25 v to 29 v. it consists of a pinned out resistor divider along with direct access to the error amplifier feedback input. the third feature is a shutdown input that allows a logic level signal to turnoff or turnon the regulator output. due to the low inputtooutput voltage differential and bias current specifications, these devices are ideally suited for battery powered computer, consumer, and industrial equipment where an extension of useful battery life is desirable. the lp2950 is available in the three pin case 29 and dpak packages, and the lp2951 is available in the eight pin dualinline, so8 and micro8 surface mount packages. the `a' suffix devices feature an initial output voltage tolerance 0.5%. lp2950 and lp2951 features: ? low quiescent bias current of 75 m a ? low inputtooutput voltage differential of 50 mv at 100 m a and 380 mv at 100 ma ? 5.0 v, 3.3 v or 3.0 v 0.5% allows use as a regulator or reference ? extremely tight line and load regulation ? requires only a 1.0 m f output capacitor for stability ? internal current and thermal limiting lp2951 additional features: ? error output signals an out of regulation condition ? output programmable from 1.25 v to 29 v ? logic level shutdown input (see following page for ordering information.)
lp2950 lp2951 3151 motorola analog ic device data ordering information device type operating temperature range package lp2950cz** lp2950acz** fixed voltage to92/to226aa lp2950cdt ** g ( 3.0 , 3.3 or 5.0 v ) lp2950cdt lp2950acdt ** (3.0, 3.3 or 5.0 v) dpak lp2950acdt ** lp2951cd lp2951acd adjustable or 5.0 v fixed so 8 lp2951cd ** adjustable or fixed so 8 lp2951cd lp2951acd ** adjustable or fixed (3 0 3 3 v) lp2951acd ** (3 . 0 , 3 . 3 v) t j =40 to +125 5 c lp2951cn lp2951acn adjustable or 5.0 v fixed t j = 40 ?? ?? c plastic lp2951cn ** adjustable or fixed pl as ti c lp2951cn lp2951acn ** adjustable or fixed (3 0 3 3 v) lp2951acn ** (3 . 0 , 3 . 3 v) lp2951cdm lp2951acdm adjustable or 5.0 v fixed micro 8 lp2951cdm ** adjustable or fixed mi cro 8 lp2951cdm lp2951acdm ** adjustable or fixed (3 0 3 3 v) lp2951acdm ** (3 . 0 , 3 . 3 v) ** = voltage option of 3.0, 3.3 or 5.0 v. device type/nominal output voltage device no. ( 1%) device no. ( 0.5%) nominal voltage lp2950cx5.0 lp2950acx5.0 5.0 lp2950cx3.3 lp2950acx3.3 3.3 lp2950cx3.0 lp2950acx3.0 3.0 lp2951cx lp2951acx adjustable or 5.0 lp2950cx3.3 lp2951acx3.3 adjustable or 3.3 lp2951cx3.0 lp2951acx3.0 adjustable or 3.0 x = package suffix. from cmos/ttl 3 representative block diagrams this device contains 34 active transistors. lp2950cz5.0 battery or unregulated dc gnd 2 output 5.0 v/100 ma 1 input 3 1.23 v reference error amplifier 182 k 60 k 1.0 m f gnd 4 182 k 60 k 1.23 v reference 1.0 m f lp2951cd or cn error amplifier battery or unregulated dc shutdown error output 5 v o tap feedback 6 7 input 8 output 1 sense 2 5.0 v/100 ma 330 k to cmos/ttl 75 mv/ 60 mv error detection comparator 50 k 60 k
lp2950 lp2951 3152 motorola analog ic device data maximum ratings (t a = 25 c, unless otherwise noted.) rating symbol value unit input voltage v cc 30 vdc power dissipation and thermal characteristics maximum power dissipation p d internally limited w case 751(so8) d suffix thermal resistance, junctiontoambient r q ja 180 c/w thermal resistance, junctiontocase r q jc 45 c/w case 369a (dpak) dt suffix [note 1] thermal resistance, junctiontoambient r q ja 92 c/w thermal resistance, junctiontocase r q jc 6.0 c/w case 29 (to226aa/to92) z suffix thermal resistance, junctiontoambient r q ja 160 c/w thermal resistance, junctiontocase r q jc 83 c/w case 626 n suffix thermal resistance, junctiontoambient r q ja 105 c/w case 846a (micro8) dm suffix thermal resistance, junctiontoambient r q ja 240 c/w feedback input voltage v fb 1.5 to +30 vdc shutdown input voltage v sd 0.3 to +30 vdc error comparator output voltage v err 0.3 to +30 vdc operating junction temperature t j 40 to +125 c storage temperature range t stg 65 to +150 c note: 1. the junctiontoambient thermal resistance is determined by pc board copper area per figure 26. 2. esd data available upon request. electrical characteristics (v in = v o + 1.0 v, i o = 100 m a, c o = 1.0 m f, t j = 25 c [note 1], unless otherwise noted.) characteristic symbol min typ max unit output voltage, 5.0 v versions v o v v in = 6.0 v, i o = 100 m a, t j = 25 c lp2950c5.0/lp2951c 4.950 5.000 5.050 lp2950ac5.0/lp2951ac 4.975 5.000 5.025 t j = 40 to +125 c lp2950c5.0/lp2951c 4.900 5.100 lp2950ac5.0/lp2951ac 4.940 5.060 v in = 6.0 to 30 v, i o = 100 m a to 100 ma, t j = 40 to +125 c lp2950c5.0/lp2951c 4.880 5.120 lp2950ac5.0/lp2951ac 4.925 5.075 output voltage, 3.3 v versions v o v v in = 4.3 v, i o = 100 m a, t j = 25 c lp2950c3.3/lp2951c3.3 3.267 3.300 3.333 lp2950ac3.3/lp2951ac3.3 3.284 3.300 3.317 t j = 40 to +125 c lp2950c3.3/lp2951c3.3 3.234 3.366 lp2950ac3.3/lp2951ac3.3 3.260 3.340 v in = 4.3 to 30 v, i o = 100 m a to 100 ma, t j = 40 to +125 c lp2950c3.3/lp2951c3.3 3.221 3.379 lp2950ac3.3/lp2951ac3.3 3.254 3.346 output voltage, 3.0 v versions v o v v in = 4.0 v, i o = 100 m a, t j = 25 c lp2950c3.0/lp2951c3.0 2.970 3.000 3.030 lp2950ac3.0/lp2951ac3.0 2.985 3.000 3.015 t j = 40 to +125 c lp2950c3.0/lp2951c3.0 2.940 3.060 lp2950ac3.0/lp2951ac3.0 2.964 3.036 v in = 4.0 to 30 v, i o = 100 m a to 100 ma, t j = 40 to +125 c lp2950c3.0/lp2951c3.0 2.928 3.072 lp2950ac3.0/lp2951ac3.0 2.958 3.042
lp2950 lp2951 3153 motorola analog ic device data electrical characteristics (continued) (v in = v o + 1.0 v, i o = 100 m a, c o = 1.0 m f, t j = 25 c [note 1], unless otherwise noted.) characteristic unit max typ min symbol line regulation (v in = v o(nom) +1.0 v to 30 v) [note 2] reg line % lp2950cxx/lp2951c/lp2951cxx 0.08 0.20 lp2950acxx/lp2951ac/lp2951acxx 0.04 0.10 load regulation (i o = 100 m a to 100 ma) reg load % lp2950cxx/lp2951c/lp2951cxx 0.13 0.20 lp2950acxx/lp2951ac/lp2951acxx 0.05 0.10 dropout voltage v i v o mv i o = 100 m a 30 80 i o = 100 ma 350 450 supply bias current i cc i o = 100 m a 93 120 m a i o = 100 ma 4.0 12 ma dropout supply bias current (v in = v o(nom) 0.5 v, i o = 100 m a) [note 2] i ccdropout 110 170 m a current limit (v o shorted to ground) i limit 220 300 ma thermal regulation reg thermal 0.05 0.20 %/w output noise voltage (10 hz to 100 khz) [note 3] v n m vrms c l = 1.0 m f 126 c l = 100 m f 56 lp2951a/lp2951ac only reference voltage (t j = 25 c) v ref v lp2951c/lp2951cxx 1.210 1.235 1.260 lp2951ac/lp2951acxx 1.220 1.235 1.250 reference voltage (t j = 40 to +125 c) v ref v lp2951c/lp2951cxx 1.200 1.270 lp2951ac/lp2951acxx 1.200 1.260 reference voltage (t j = 40 to +125 c) v ref v i o = 100 m a to 100 ma, v in = 23 to 30 v lp2951c/lp2951cxx 1.185 1.285 lp2951ac/lp2951acxx 1.190 1.270 feedback pin bias current i fb 15 40 na error comparator output leakage current (v oh = 30 v) i lkg 0.01 1.0 m a output low voltage (v in = 4.5 v, i ol = 400 m a) v ol 150 250 mv upper threshold voltage (v in = 6.0 v) v thu 40 45 mv lower threshold voltage (v in = 6.0 v) v thl 60 95 mv hysteresis (v in = 6.0 v) v hy 15 mv shutdown input input logic voltage v shtdn v logic a0o (regulator aono) 0 0.7 logic a1o (regulator aoffo) 2.0 30 shutdown pin input current i shtdn m a v shtdn = 2.4 v 35 50 v shtdn = 30 v 450 600 regulator output current in shutdown mode i off 3.0 10 m a (v in = 30 v, v shtdn = 2.0 v, v o = 0, pin 6 connected to pin 7) notes: 1. low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 2. v o(nom) is the part number voltage option. 3 . noise tests on the lp2951 are made with a 0.01 m f capacitor connected across pins 7 and 1.
lp2950 lp2951 3154 motorola analog ic device data definitions dropout voltage the input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. measured when the output drops 100 mv below its nominal value (which is measured at 1.0 v differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. line regulation the change in output voltage for a change in input voltage. the measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. load regulation the change in output voltage for a change in load current at constant chip temperature. maximum power dissipation the maximum total device dissipation for which the regulator will operate within specifications. bias current current which is used to operate the regulator chip and is not delivered to the load. output noise voltage the rms ac voltage at the output, with constant load and no input ripple, measured over a specified frequency range. leakage current current drawn through a bipolar transistor collectorbase junction, under a specified collector voltage, when the transistor is aoffo. upper threshold voltage voltage applied to the comparator input terminal, below the reference voltage which is applied to the other comparator input terminal, which causes the comparator output to change state from a logic a0o to a1o. lower threshold voltage voltage applied to the comparator input terminal, below the reference voltage which is applied to the other comparator input terminal, which causes the comparator output to change state from a logic a1o to a0o. hysteresis the difference between lower threshold voltage and upper threshold voltage. figure 1. quiescent current , output voltage (v) v out , output voltage (v) v out 50 5.00 0 6.0 0 250 0.1 10 t a , ambient temperature ( c) v in , input voltage (v) bias current ( a ) m v in , input voltage (v) lp2950/lp2951 bias current (ma ) i l , load current (ma) figure 2. dropout characteristics figure 3. input current figure 4. output voltage versus temperature 1.0 10 100 1.0 2.0 3.0 4.0 5.0 6.0 5.0 10 15 20 25 0 50 100 150 1.0 0.1 0.01 5.0 4.0 3.0 2.0 1.0 0 4.99 4.98 4.97 4.96 4.95 200 150 100 50 0 r l = 50 k r l = 50 w 0.1 ma load current no load lp2951c t a = 25 c lp2951c
lp2950 lp2951 3155 motorola analog ic device data r l dropout voltage (mv) = 50 t, temperature ( c) 0 200 0 8.0 50 550 100 7.0 4.70 5.0 0.1 400 load current (ma) t, time (ms) , input voltage (v) t, time ( m s) shutdown and output voltage (v) t, time ( m s) , output voltage (v) v in , input voltage (v) dropout voltage (mv) figure 5. dropout voltage versus output current i o , output current (ma) figure 6. dropout voltage versus temperature figure 7. error comparator output figure 8. line transient response figure 9. lp2951 enable transient figure 10. load transient response 1.0 10 100 0 50 100 150 4.74 4.78 4.82 4.86 100 200 300 4.90 400 500 600 700 800 0 100 200 300 400 400 250 50 150 200 300 350 100 300 200 0 500 450 400 300 7.5 7.0 6.5 6.0 5.5 4.0 3.0 1.0 0 5.0 3.0 1.0 1.0 150 100 0 50 50 r l = 50 v in decreasing v in increasing v in v out r l = 50 k t a = 25 c c l = 1.0 m f i l = 1.0 ma v o = 5.0 v c l = 1.0 m f v out = 5.0 v t a = 25 c v out i load t a = 25 c i l = 10 ma v in = 8.0 v v out = 5.0 v c l = 10 m f shutdown input 350 r l dropout voltage (mv) = 50 k 55 50 45 40 30 35 350 250 150 100 2.0 output voltage change (mv) 4.0 2.0 0 2.0 6.0 4.0 output voltage change (mv) 0 200 200 400 400 6.0 4.0 2.0 0 50 v in v out c l = 1.0 m f t a = 25 c lp2951c r l = 330 k t a = 25 c
lp2950 lp2951 3156 motorola analog ic device data 0 100 100 4.0 40 1.8 1.0 80 v out , output current (ma) v in , input voltage (v) voltage noise ( v/ hz) f, frequency (hz) shutdown threshold voltage (v ) t, temperature ( c) ripple rejection (db ) figure 11. ripple rejection f, frequency (hz) figure 12. output noise figure 13. shutdown threshold voltage versus temperature figure 14. maximum rated output current t a = 25 c c l = 1.0 m f v in = 6.0 v v out = 5.0 v c l = 1.0 m f m c l = 100 m f i l = 0.1 ma i l = 100 ma t a = 25 c v o = 5.0 v lp2951c output aoffo output aono t a = 25 c lp2951cn 60 40 20 0 3.0 2.0 1.0 0 80 60 40 20 0 1.4 1.0 0.8 1.2 1.6 10 100 1.0 k 10 k 100 k 1.0 k 10 k 100 k 20 40 80 120 160 5.0 15 25 35 40 10 20 30 60 100 140 20 0 t a = 75 c 4.0 2.0 0 2.0 4.0 6.0 output voltage change (mv )
lp2950 lp2951 3157 motorola analog ic device data applications information introduction the lp2950/lp2951 regulators are designed with internal current limiting and thermal shutdown making them userfriendly. typical application circuits for the lp2950 and lp2951 are shown in figures 17 through 25. these regulators are not internally compensated and thus require a 1.0 m f (or greater) capacitance between the lp2950/lp2951 output terminal and ground for stability. most types of aluminum, tantalum or multilayer ceramic will perform adequately. solid tantalums or appropriate multilayer ceramic capacitors are recommended for operation below 25 c. at lower values of output current, less output capacitance is required for output stability. the capacitor can be reduced to 0.33 m f for currents less than 10 ma, or 0.1 m f for currents below 1.0 ma. using the 8pin versions at voltages less than 5.0 v operates the error amplifier at lower values of gain, so that more output capacitance is needed for stability. for the worst case operating condition of a 100 ma load at 1.23 v output (output pin 1 connected to the feedback pin 7) a minimum capacitance of 3.3 m f is recommended. the lp2950 will remain stable and in regulation when operated with no output load. when setting the output voltage of the lp2951 with external resistors, the resistance values should be chosen to draw a minimum of 1.0 m a. a bypass capacitor is recommended across the lp2950/lp2951 input to ground if more than 4 inches of wire connects the input to either a battery or power supply filter capacitor. input capacitance at the lp2951 feedback pin 7 can create a pole, causing instability if high value external resistors are used to set the output voltage. adding a 100 pf capacitor between the output pin 1 and the feedback pin 7 and increasing the output filter capacitor to at least 3.3 m f will stabilize the feedback loop. error detection comparator the comparator switches to a positive logic low whenever the lp2951 output voltage falls more than approximately 5.0% out of regulation. this value is the comparator's designedin offset voltage of 60 mv divided by the 1.235 v internal reference. as shown in the representative block diagram. this trip level remains 5.0% below normal regardless of the value of regulated output voltage. for example, the error flag trip level is 4.75 v for a normal 5.0 v regulated output, or 9.50 v for a 10 v output voltage. figure 1 is a timing diagram which shows the error signal and the regulated output voltage as the input voltage to the lp2951 is ramped up and down. the error signal becomes valid (low) at about 1.3 v input. it goes high when the input reaches about 5.0 v (v out exceeds about 4.75 v). since the lp2951's dropout voltage is dependent upon the load current (refer to the curve in the typical performance characteristics), the input voltage trip point will vary with load current. the output voltage trip point does not vary with load. the error comparator output is an open collector which requires an external pullup resistor. this resistor may be returned to the output or some other voltage within the system. the resistance value should be chosen to be consistent with the 400 m a sink capability of the error comparator. a value between 100 k and 1.0 m w is suggested. no pullup resistance is required if this output is unused. when operated in the shutdown mode, the error comparator output will go high if it has been pulled up to an external supply. to avoid this invalid response, the error comparator output should be pulled up to v out (see figure 15). figure 15. error output timing 5.0 v 4.75 v 4.70 v 4.75 v + v dropout 4.70 v + v dropout 1.3 v 1.3 v not valid pullup to v out pullup to ext output voltage error input voltage not valid programming the output voltage (lp2951) the lp2951cx may be pinstrapped for 5.0 v using its internal voltage divider by tying pin 1 (output) to pin 2 (sense) and pin 7 (feedback) to pin 6 (5.0 v tap). alternatively, it may be programmed for any output voltage between its 1.235 reference voltage and its 30 v maximum rating. an external pair of resistors is required, as shown in figure 16. figure 16. adjustable regulator error output shutdown input v in v out 1.23 to 30 v 3.3 m f 0.01 m f nc nc r 2 r1 100 k 5 3 error sd gnd fb 47 6 v o t sns 2 v out v in 8 1 the complete equation for the output voltage is: v out ref ( 1 r1 r2 ) i fb r1 where v ref is the nominal 1.235 v reference voltage and i fb is the feedback pin bias current, nominally 20 na. the minimum recommended load current of 1.0 m a forces an upper limit of 1.2 m w on the value of r2, if the regulator must work with no load. i fb will produce a 2% typical error in v out which may be eliminated at room temperature by adjusting r1. for better accuracy, choosing r2 = 100 k reduces this
lp2950 lp2951 3158 motorola analog ic device data error to 0.17% while increasing the resistor program current to 12 m a. since the lp2951 typically draws 75 m a at no load with pin 2 open circuited, the extra 12 m a of current drawn is often a worthwhile tradeoff for eliminating the need to set output voltage in test. output noise in many applications it is desirable to reduce the noise present at the output. reducing the regulator bandwidth by increasing the size of the output capacitor is the only method for reducing noise on the 3 lead lp2950. however, increasing the capacitor from 1.0 m f to 220 m f only decreases the noise from 430 m v to 160 m vrms for a 100 khz bandwidth at the 5.0 v output. noise can be reduced fourfold by a bypass capacitor across r1, since it reduces the high frequency gain from 4 to unity. pick c bypass 1 2 r1 x 200 hz or about 0.01 m f. when doing this, the output capacitor must be increased to 3.3 m f to maintain stability. these changes reduce the output noise from 430 m v to 126 m vrms for a 100 khz bandwidth at 5.0 v output. with bypass capacitor added, noise no longer scales with output voltage so that improvements are more dramatic at higher output voltages. figure 17. 1.0 a regulator with 1.2 v dropout 0.01 m f 10 k mtb23p06e 1.0 m f unregulated input error output shutdown input v out 5.0 v 1.0% 0 to 1.0 a 220 m f 2.0 k 5 3 error sd gnd fb 47 6 v o t sns 2 v out v in 8 1 0.002 m f 1.0 m lp2951cn
lp2950 lp2951 3159 motorola analog ic device data typical applications figure 18. lithium ion battery cell charger 1n4001 gnd 4.2 v 0.025 v nc nc 50 k 5 3 error sd gnd fb 47 6 v o t sns 2 v out v in 8 1 0.1 m f nc lp2951cn 2.2 m f 330 pf 806 k 1.0% 2.0 m 1.0% lithium ion rechargeable cell unregulated input 6.0 to 10 vdc figure 19. low drift current sink error output shutdown input +v = 2.0 to 30 v 1.0 m f r 5 3 error sd gnd fb 47 6 v o t sns 2 v out v in 8 1 0.1 m f load i l = 1.23/r i l figure 20. latch off when error flag occurs reset +v in v out 1.0 m f nc nc r2 r1 470 k 5 3 error sd gnd fb 47 6 v o t sns 2 v out v in 8 1 lp2951cn 470 k error flag occurs when v in is too low to maintain v out , or if v out is reduced by excessive load current. normally closed 2n3906 figure 21. 5.0 v regulator with 2.5 v sleep function *sleep input +v in v out 3.3 m f nc nc 100 k 100 k 470 k 5 3 error sd gnd fb 47 6 v o t sns 2 v out v in 8 1 lp2951cn 200 k 100 pf 2n3906 47 k cmos gate error output shutdown input lp2951cn
lp2950 lp2951 3160 motorola analog ic device data 330 k figure 22. regulator with early warning and auxiliary output +v in memory v+ 1.0 m f 20 5 3 error sd gnd fb 47 6 v o t sns 2 v out v in 8 1 lp2951cn #1 1.0 m f 5 3 error sd gnd fb 47 6 v o t sns 2 v out v in 8 1 lp2951cn #2 nc reset v dd m p early warning all diodes are 1n4148. early warning flag on low input voltage. main output latches off at lower input voltages. battery backup on auxiliary output. operation: regulator #1's v out is programmed one diode drop above 5.0 v. its error flag becomes active when v in < 5.7 v. when v in drops below 5.3 v, the error flag of regulator #2 becomes active and via q1 latches the main output aoffo. when v in again exceeds 5.7 v, regulator #1 is back in regulation and the early warning signal rises, unlatching regulator #2 via d3. d4 2.7 m q1 2n3906 d2 d1 d3 27 k 3.6 v nicad main output figure 23. 2.0 a low dropout regulator +v in v out @ 2.0 a 100 m f nc nc r2 r1 470 5 3 error sd gnd fb 47 6 v o t sns 2 v out v in 8 1 lp2951cn mje2955 4.7 m error flag v out = 1.25v (1.0 + r1/r2) for 5.0 v output, use internal resistors. wire pin 6 to 7, and wire pin 2 to +v out bus. 20 k 47 4.7 m f tant 0.05 680 0.033 m f 2n3906 10 k current limit section 220 1000 m f .33 m f .01 m f 2n3906
lp2950 lp2951 3161 motorola analog ic device data figure 24. open circuit detector for 4.0 to 20 ma current loop 5 3 error sd gnd fb 47 6 v o t sns 2 v out v in 8 1 lp2951cn nc output* 0.1 m f nc nc nc 1n457 1n457 360 1n457 1n4001 24 + 5.0 v 4.7 k 15 20 ma 4 * high for i l < 3.5 ma figure 25. low battery disconnect 2n3906 5 3 error sd gnd fb 47 6 v o t sns 2 v out v in 8 1 lp2951cn nc 1.0 m f nc 2 3 1 20 main v+ memory v+ 6.0 v leadacid battery nicad backup battery 100 k 31.6 k mc34164p5 nc r , thermal resistance ja q junction-to-air ( c/w) 40 50 60 70 80 90 100 0 0.4 0.8 1.2 1.6 2.0 2.4 0102030 25 15 5.0 l, length of copper (mm) p d(max) for t a = 50 c minimum size pad p d l l ??? ??? ??? ??? , maximum power dissipation (w) free air mounted vertically r q ja 2.0 oz. copper figure 26. dpak thermal resistance and maximum power dissipation versus p.c.b. copper length
121 motorola analog ic device data tape and reel options in brief . . . page tape and reel configurations 122 . . . . . . . . . . . . . . . . . . . . . tape and reel information table 124 . . . . . . . . . . . . . . . . . . . analog mpq table 125 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . motorola offers the convenience of tape and reel packaging for our growing family of standard integrated circuit products. reels are available to support the requirements of both first and second generation pickandplace equipment. the packaging fully conforms to the latest eia481a specification. the antistatic embossed tape provides a secure cavity, sealed with a peelback cover tape.
122 motorola analog ic device data tape and reel configurations typical user direction of feed soic and micro8 devices pin 1 typical user direction of feed plcc devices typical user direction of feed dpak and d 2 pak devices mechanical polarization typical user direction of feed sot23 (5 pin) devices typical sot89 (3 pin) devices user direction of feed typical sot89 (5 pin) devices user direction of feed
123 motorola analog ic device data tape and reel configurations (continued) style a (preferred) to92 reel styles carrier strip adhesive tape rounded side feed rounded side of transistor and adhesive tape visible. flat side of transistor and adhesive tape visible. feed adhesive tape on top side carrier strip adhesive tape on top side style m ammo pack is equivalent to style e of reel pack dependent on feed orientation from box. flat side label style m style p (preferred) rounded side style p ammo pack is equivalent to styles a and b of reel pack dependent on feed orientation from box. flat side of transistor and adhesive tape visible. rounded side of transistor and adhesive tape visible. to92 ammo pack styles carrier strip adhesive tape flat side label carrier strip style e feed feed h2a h2a h f1 f2 p2 p2 p1 p d w w1 l1 w2 h2b h2b t1 t t2 h4 h5 h1 l to92 eia radial tape in fan fold box or on reel
124 motorola analog ic device data tape and reel information table tape width devices (1) reel size device package p (mm) per reel (inch) suffix so8, sop8 12 2,500 13 r2 so14 16 2,500 13 r2 so16 16 2,500 13 r2 so16l, so8+8l wide 16 1,000 13 r2 so20l wide 24 1,000 13 r2 so24l wide 24 1,000 13 r2 so28l wide 24 1,000 13 r2 so28l wide 32 1,000 13 r3 micro8 12 2,500 13 r2 plcc20 16 1,000 13 r2 plcc28 24 500 13 r2 plcc44 32 500 13 r2 plcc52 32 500 13 r2 plcc68 44 250 13 r2 plcc84 44 250 13 r2 to226aa (to92) (2) 18 2,000 13 ra, re, rp, or rm (ammo pack) only dpak 16 2,500 13 rk d 2 pak 24 800 13 r4 sot23 (5 pin) 8 3,000 7 tr sot89 (3/5 pin) 12 1,000 7 t1 (1) minimum order quantity is 1 reel. distributors/oem customers may break lots or reels at their option, however broken reels may not be returned. (2) integrated circuits in to226aa packages are available in styes a and e only, with optional aammo packo (suffix rp or rm). the ra and rp configurations are preferred. for ordering information please contact your local motorola semiconductor sales office.
125 motorola analog ic device data analog mpq table tape/reel and ammo pack package type package code mpq package type package code mpq plcc case 775 0802 1000/reel case 776 0804 500/reel case 777 0801 500/reel soic case 751 0095 2500/reel case 751a 0096 2500/reel case 751b 0097 2500/reel case 751g 2003 1000/reel case 751d 2005 1000/reel case 751e 2008 1000/reel case 751f 2009 1000/reel micro8 case 846a 2500/reel to92 case 29 0031 2000/reel case 29 0031 2000/ammo pack dpak case 369a 2500/reel d 2 pak case 936 800/reel sot23 (5 pin) case 1212 3000/reel sot89 (3 pin) case 1213 1000/reel sot89 (5 pin) case 1214 1000/reel
126 motorola analog ic device data
131 motorola analog ic device data packaging information in brief . . . the packaging availability for each device type is indicated on the individual data sheets and the selector guide. all of the outline dimensions for the packages are given in this section. the maximum power consumption an integrated circuit can tolerate at a given operating ambient temperature can be found from the equation: t j(max) t a r q ja(typ) p d(ta) = where: p d(ta) = power dissipation allowable at a given operating ambient temperature. this must be greater than the sum of the products of the supply voltages and supply currents at the worst case operating condition. t j(max) = maximum operating junction temperature as listed in the maximum ratings section. see individual data sheets for t j(max) information. t a = maximum desired operating ambient temperature r q ja(typ) = typical thermal resistance junction-to- ambient
132 motorola analog ic device data case outline dimensions lp, p, z suffix case 29-04 plastic package (to-226aa/to-92) issue ad kc, t suffix case 221a-06 plastic package issue y notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. contour of package beyond dimension r is uncontrolled. 4. dimension f applies between p and l. dimension d and j apply between l and k minimum. lead dimension is uncontrolled in p and beyond dimension k minimum. dim min max min max millimeters inches a 0.175 0.205 4.45 5.20 b 0.170 0.210 4.32 5.33 c 0.125 0.165 3.18 4.19 d 0.016 0.022 0.41 0.55 f 0.016 0.019 0.41 0.48 g 0.045 0.055 1.15 1.39 h 0.095 0.105 2.42 2.66 j 0.015 0.020 0.39 0.50 k 0.500 12.70 l 0.250 6.35 n 0.080 0.105 2.04 2.66 p 0.100 2.54 r 0.115 2.93 v 0.135 3.43 r a p j l f b k g h section xx c v d n n xx seating plane 1 1 2 3 1 2 3 4 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. a k l g d n h q f 123 4 t seating plane s r j u t c 3 pl b y m b m 0.25 (0.010) y dim min max min max millimeters inches a 0.560 0.625 14.23 15.87 b 0.380 0.420 9.66 10.66 c 0.140 0.190 3.56 4.82 d 0.020 0.045 0.51 1.14 f 0.139 0.155 3.53 3.93 g 0.100 bsc 2.54 bsc h 0.280 7.11 j 0.012 0.045 0.31 1.14 k 0.500 0.580 12.70 14.73 l 0.045 0.070 1.15 1.77 n 0.200 bsc 5.08 bsc q 0.100 0.135 2.54 3.42 r 0.080 0.115 2.04 2.92 s 0.020 0.055 0.51 1.39 t 0.235 0.255 5.97 6.47 u 0.000 0.050 0.00 1.27
133 motorola analog ic device data t suffix case 314c01 plastic package issue a th suffix case 314a-03 plastic package issue d t, tv suffix case 314b-05 plastic package issue j 1 5 1 5 1 5 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 0.043 (1.092) maximum. dim a min max min max millimeters 0.572 0.613 14.529 15.570 inches b 0.390 0.415 9.906 10.541 c 0.170 0.180 4.318 4.572 d 0.025 0.038 0.635 0.965 e 0.048 0.055 1.219 1.397 f 0.570 0.585 14.478 14.859 g 0.067 bsc 1.702 bsc j 0.015 0.025 0.381 0.635 k 0.730 0.745 18.542 18.923 l 0.320 0.365 8.128 9.271 q 0.140 0.153 3.556 3.886 s 0.210 0.260 5.334 6.604 u 0.468 0.505 11.888 12.827 t seating plane l s e c f k j optional chamfer 5x d 5x m p m 0.014 (0.356) t g a u b q p notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 10.92 (0.043) maximum. a k b q 5 pl d g j c m q m 0.356 (0.014) t l e t seating plane 12345 dim min max min max millimeters inches a 0.610 0.625 15.59 15.88 b 0.380 0.420 9.65 10.67 c 0.160 0.190 4.06 4.83 d 0.020 0.040 0.51 1.02 e 0.035 0.055 0.89 1.40 g 0.067 bsc 1.702 bsc j 0.015 0.025 0.38 0.64 k 0.500 12.70 l 0.355 0.370 9.02 9.40 q 0.139 0.147 3.53 3.73 v q k f u a b g p m 0.10 (0.254) p m t 5x j m 0.24 (0.610) t optional chamfer s l w e c h n t seating plane notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 0.043 (1.092) maximum. dim min max min max millimeters inches a 0.572 0.613 14.529 15.570 b 0.390 0.415 9.906 10.541 c 0.170 0.180 4.318 4.572 d 0.025 0.038 0.635 0.965 e 0.048 0.055 1.219 1.397 f 0.850 0.935 21.590 23.749 g 0.067 bsc 1.702 bsc h 0.166 bsc 4.216 bsc j 0.015 0.025 0.381 0.635 k 0.900 1.100 22.860 27.940 l 0.320 0.365 8.128 9.271 n 0.320 bsc 8.128 bsc q 0.140 0.153 3.556 3.886 s 0.620 15.748 u 0.468 0.505 11.888 12.827 v 0.735 18.669 w 0.090 0.110 2.286 2.794 5x d
134 motorola analog ic device data dt-1 suffix case 369-07 plastic package (dpak) issue k t, t1 suffix case 314d-03 plastic package issue d 2 3 4 1 2 3 1 4 5 dt suffix case 369a-13 plastic package (dpak) issue y 4 3 1 d a k b r v s f l g 2 pl m 0.13 (0.005) t e c u j h t seating plane z dim min max min max millimeters inches a 0.235 0.250 5.97 6.35 b 0.250 0.265 6.35 6.73 c 0.086 0.094 2.19 2.38 d 0.027 0.035 0.69 0.88 e 0.033 0.040 0.84 1.01 f 0.037 0.047 0.94 1.19 g 0.180 bsc 4.58 bsc h 0.034 0.040 0.87 1.01 j 0.018 0.023 0.46 0.58 k 0.102 0.114 2.60 2.89 l 0.090 bsc 2.29 bsc r 0.175 0.215 4.45 5.46 s 0.020 0.050 0.51 1.27 u 0.020 0.51 v 0.030 0.050 0.77 1.27 z 0.138 3.51 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 123 4 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 123 4 v s a k t seating plane r b f g d 3 pl m 0.13 (0.005) t c e j h dim min max min max millimeters inches a 0.235 0.250 5.97 6.35 b 0.250 0.265 6.35 6.73 c 0.086 0.094 2.19 2.38 d 0.027 0.035 0.69 0.88 e 0.033 0.040 0.84 1.01 f 0.037 0.047 0.94 1.19 g 0.090 bsc 2.29 bsc h 0.034 0.040 0.87 1.01 j 0.018 0.023 0.46 0.58 k 0.350 0.380 8.89 9.65 r 0.175 0.215 4.45 5.46 s 0.050 0.090 1.27 2.28 v 0.030 0.050 0.77 1.27 q 12345 u k d g s a b 5 pl j h l e c m q m 0.356 (0.014) t seating plane t dim min max min max millimeters inches a 0.572 0.613 14.529 15.570 b 0.390 0.415 9.906 10.541 c 0.170 0.180 4.318 4.572 d 0.025 0.038 0.635 0.965 e 0.048 0.055 1.219 1.397 g 0.067 bsc 1.702 bsc h 0.087 0.112 2.210 2.845 j 0.015 0.025 0.381 0.635 k 1.020 1.065 25.908 27.051 l 0.320 0.365 8.128 9.271 q 0.140 0.153 3.556 3.886 u 0.105 0.117 2.667 2.972 s 0.543 0.582 13.792 14.783 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 10.92 (0.043) maximum.
135 motorola analog ic device data dp1, n, p, p1 suffix case 626-05 plastic package issue k n, p, n-14, p2 suffix case 646-06 plastic package issue l 14 1 dp2, n, p, pc suffix case 648-08 plastic package issue r 16 1 8 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. a b f c s h g d j l m 16 pl seating 18 9 16 k plane t m a m 0.25 (0.010) t dim min max min max millimeters inches a 0.740 0.770 18.80 19.55 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.040 0.70 1.02 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.110 0.130 2.80 3.30 l 0.295 0.305 7.50 7.74 m 0 10 0 10 s 0.020 0.040 0.51 1.01 notes: 1. leads within 0.13 (0.005) radius of true position at seating plane at maximum material condition. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 4. rounded corners optional. 17 14 8 b a f hg d k c n l j m seating plane dim min max min max millimeters inches a 0.715 0.770 18.16 19.56 b 0.240 0.260 6.10 6.60 c 0.145 0.185 3.69 4.69 d 0.015 0.021 0.38 0.53 f 0.040 0.070 1.02 1.78 g 0.100 bsc 2.54 bsc h 0.052 0.095 1.32 2.41 j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.300 bsc 7.62 bsc m 0 10 0 10 n 0.015 0.039 0.39 1.01 notes: 1. dimension l to center of lead when formed parallel. 2. package contour optional (round or square corners). 3. dimensioning and tolerancing per ansi y14.5m, 1982. 14 5 8 f note 2 a b t seating plane h j g d k n c l m m a m 0.13 (0.005) b m t dim min max min max inches millimeters a 9.40 10.16 0.370 0.400 b 6.10 6.60 0.240 0.260 c 3.94 4.45 0.155 0.175 d 0.38 0.51 0.015 0.020 f 1.02 1.78 0.040 0.070 g 2.54 bsc 0.100 bsc h 0.76 1.27 0.030 0.050 j 0.20 0.30 0.008 0.012 k 2.92 3.43 0.115 0.135 l 7.62 bsc 0.300 bsc m 10 10 n 0.76 1.01 0.030 0.040
136 motorola analog ic device data b, p, p2, v suffix case 648c-03 plastic package (dip16) issue c 16 1 p suffix case 648e01 plastic package (dip16) issue o p suffix case 649-03 plastic package issue d 24 1 notes: 1. leads within 0.13 (0.005) radius of true position at seating plane at maximum material condition. 2. dimension l to center of leads when formed parallel. seating plane 1 12 24 13 j g f c k b h n q p a d m l dim min max min max inches millimeters a 31.50 32.13 1.240 1.265 b 13.21 13.72 0.520 0.540 c 4.70 5.21 0.185 0.205 d 0.38 0.51 0.015 0.020 f 1.02 1.52 0.040 0.060 g 2.54 bsc 0.100 bsc h 1.65 2.16 0.065 0.085 j 0.20 0.30 0.008 0.012 k 2.92 3.43 0.115 0.135 l 14.99 15.49 0.590 0.610 m 10 10 n 0.51 1.02 0.020 0.040 p 0.13 0.38 0.005 0.015 q 0.51 0.76 0.020 0.030 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension a and b does not include mold protrusion. 5. mold flash or protrusions shall not exceed 0.25 (0.010). 6. rounded corner optional. a b 16 9 18 d g h s c 13 pl s b m 0.25 (0.010) t t seating plane j m l r p f k s a dim min max min max millimeters inches a 0.740 0.760 18.80 19.30 b 0.245 0.260 6.23 6.60 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.050 0.070 1.27 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.120 0.140 3.05 3.55 l 0.295 0.305 7.50 7.74 m 0 10 0 10 p 0.200 bsc 5.08 bsc r 0.300 bsc 7.62 bsc s 0.015 0.035 0.39 0.88 dim min max min max millimeters inches a 0.740 0.840 18.80 21.34 b 0.240 0.260 6.10 6.60 c 0.145 0.185 3.69 4.69 d 0.015 0.021 0.38 0.53 e 0.050 bsc 1.27 bsc f 0.040 0.70 1.02 1.78 g 0.100 bsc 2.54 bsc j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.300 bsc 7.62 bsc m 0 10 0 10 n 0.015 0.040 0.39 1.01 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. internal lead connection between 4 and 5, 12 and 13. a b 16 9 18 f d g e n k c note 5 16 pl s a m 0.13 (0.005) t t seating plane s b m 0.13 (0.005) t j 16 pl m l 1 16
137 motorola analog ic device data a, b, n, p suffix case 707-02 plastic package issue c 18 1 p suffix case 710-02 plastic package issue b 28 1 notes: 1. positional tolerance of leads (d), shall be within 0.25 (0.010) at maximum material condition, in relation to seating plane and each other. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 1 seating plane 15 14 28 m a b k c n f g d h j l dim min max min max inches millimeters a 36.45 37.21 1.435 1.465 b 13.72 14.22 0.540 0.560 c 3.94 5.08 0.155 0.200 d 0.36 0.56 0.014 0.022 f 1.02 1.52 0.040 0.060 g 2.54 bsc 0.100 bsc h 1.65 2.16 0.065 0.085 j 0.20 0.38 0.008 0.015 k 2.92 3.43 0.115 0.135 l 15.24 bsc 0.600 bsc m 0 15 0 15 n 0.51 1.02 0.020 0.040 notes: 1. positional tolerance of leads (d), shall be within 0.25 (0.010) at maximum material condition, in relation to seating plane and each other. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 1 seating plane 10 9 18 m a b k c n f g d h j l dim min max min max inches millimeters a 22.22 23.24 0.875 0.915 b 6.10 6.60 0.240 0.260 c 3.56 4.57 0.140 0.180 d 0.36 0.56 0.014 0.022 f 1.27 1.78 0.050 0.070 g 2.54 bsc 0.100 bsc h 1.02 1.52 0.040 0.060 j 0.20 0.30 0.008 0.012 k 2.92 3.43 0.115 0.135 l 7.62 bsc 0.300 bsc m 0 15 0 15 n 0.51 1.02 0.020 0.040 p suffix case 711-03 plastic package issue c 40 1 notes: 1. positional tolerance of leads (d), shall be within 0.25 (0.010) at maximum material condition, in relation to seating plane and each other. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 120 40 21 b a c seating plane d f g h k n m j l dim min max min max inches millimeters a 51.69 52.45 2.035 2.065 b 13.72 14.22 0.540 0.560 c 3.94 5.08 0.155 0.200 d 0.36 0.56 0.014 0.022 f 1.02 1.52 0.040 0.060 g 2.54 bsc 0.100 bsc h 1.65 2.16 0.065 0.085 j 0.20 0.38 0.008 0.015 k 2.92 3.43 0.115 0.135 l 15.24 bsc 0.600 bsc m 0 15 0 15 n 0.51 1.02 0.020 0.040
138 motorola analog ic device data d, d1, d2 suffix case 751-05 plastic package (so-8, sop-8) issue r h, p, dp suffix case 738-03 plastic package issue e f, p, p-3 suffix case 724-03 plastic package (ndip24) issue d 24 1 notes: 1. chamfered contour optional. 2. dimension l to center of leads when formed parallel. 3. dimensioning and tolerancing per ansi y14.5m, 1982. 4. controlling dimension: inch. a b 24 13 12 1 t seating plane 24 pl k e f n c d g m a m 0.25 (0.010) t 24 pl j m b m 0.25 (0.010) t l m note 1 dim min max min max millimeters inches a 1.230 1.265 31.25 32.13 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.020 0.38 0.51 e 0.050 bsc 1.27 bsc f 0.040 0.060 1.02 1.52 g 0.100 bsc 2.54 bsc j 0.007 0.012 0.18 0.30 k 0.110 0.140 2.80 3.55 l 0.300 bsc 7.62 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.01 20 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimension b does not include mold flash. m l j 20 pl m b m 0.25 (0.010) t dim min max min max millimeters inches a 25.66 27.17 1.010 1.070 b 6.10 6.60 0.240 0.260 c 3.81 4.57 0.150 0.180 d 0.39 0.55 0.015 0.022 g 2.54 bsc 0.100 bsc j 0.21 0.38 0.008 0.015 k 2.80 3.55 0.110 0.140 l 7.62 bsc 0.300 bsc m 0 15 0 15 n 0.51 1.01 0.020 0.040 e 1.27 1.77 0.050 0.070 1 11 10 20 a seating plane k n f g d 20 pl t m a m 0.25 (0.010) t e b c f 1.27 bsc 0.050 bsc 8 1 seating plane 1 4 5 8 a 0.25 m cb ss 0.25 m b m h c x 45 l dim min max millimeters a 1.35 1.75 a1 0.10 0.25 b 0.35 0.49 c 0.18 0.25 d 4.80 5.00 e 1.27 bsc e 3.80 4.00 h 5.80 6.20 h 0 7 l 0.40 1.25 0.25 0.50 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. dimensions are in millimeters. 3. dimension d and e do not include mold protrusion. 4. maximum mold protrusion 0.15 per side. 5. dimension b does not include mold protrusion. allowable dambar protrusion shall be 0.127 total in excess of the b dimension at maximum material condition. d e h a b e b a1 c a 0.10
139 motorola analog ic device data d suffix case 751a-03 plastic package (so-14) issue f 14 1 d suffix case 751b-05 plastic package (so-16) issue j 16 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. a b g p 7 pl 14 8 7 1 m 0.25 (0.010) b m s b m 0.25 (0.010) a s t t f r x 45 seating plane d 14 pl k c j m dim min max min max inches millimeters a 8.55 8.75 0.337 0.344 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.228 0.244 r 0.25 0.50 0.010 0.019 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 18 16 9 seating plane f j m r x 45 g 8 pl p b a m 0.25 (0.010) b s t d k c 16 pl s b m 0.25 (0.010) a s t dim min max min max inches millimeters a 9.80 10.00 0.386 0.393 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019 dw, fp suffix case 751d-04 plastic package (so-20l, so20) issue e 20 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.150 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b 20 1 11 10 s a m 0.010 (0.25) b s t d 20x m b m 0.010 (0.25) p 10x j f g 18x k c t seating plane m r x 45 dim min max min max inches millimeters a 12.65 12.95 0.499 0.510 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.50 0.90 0.020 0.035 g 1.27 bsc 0.050 bsc j 0.25 0.32 0.010 0.012 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029
1310 motorola analog ic device data dw suffix case 751e-04 plastic package (so-24l, sop (16+4+4)l) issue e 24 1 dw suffix case 751f-04 plastic package (so-28l, soic28) issue e 28 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b p 12x d 24x 12 13 24 1 m 0.010 (0.25) b m s a m 0.010 (0.25) b s t t g 22x seating plane k c r x 45 m f j dim min max min max inches millimeters a 15.25 15.54 0.601 0.612 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.41 0.90 0.016 0.035 g 1.27 bsc 0.050 bsc j 0.23 0.32 0.009 0.013 k 0.13 0.29 0.005 0.011 m 0 8 0 8 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. j k f 1 15 14 28 a b 28x 14x d p s a m 0.010 (0.25) b s t m 0.010 (0.25) b m 26x g t seating plane c x 45 r m dim min max min max inches millimeters a 17.80 18.05 0.701 0.711 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.41 0.90 0.016 0.035 g 1.27 bsc 0.050 bsc j 0.23 0.32 0.009 0.013 k 0.13 0.29 0.005 0.011 m 0 8 0 8 p 10.01 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 dw suffix case 751g-02 plastic package (so-16l, sop16l, sop-8+8l) issue a 16 1 dim min max min max inches millimeters a 10.15 10.45 0.400 0.411 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.50 0.90 0.020 0.035 g 1.27 bsc 0.050 bsc j 0.25 0.32 0.010 0.012 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 m b m 0.010 (0.25) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b p 8x g 14x d 16x seating plane t s a m 0.010 (0.25) b s t 16 9 8 1 f j r x 45 m c k
1311 motorola analog ic device data d suffix case 751k01 plastic package (so16) issue o 16 1 dw suffix case 751n01 plastic package (sop16l) issue o notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimensions a and b do not include mold protrusion. 4 maximum mold protrusion 0.15 (0.006) per side. 5 dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. dim a min max min max inches 9.80 10.00 0.368 0.393 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019 18 9 16 g p c k 14 x d seating plane j r m a b m 0.25 (0.010) b s f x 45 t s a m 0.25 (0.010) b s t 16 1 dim min max min max inches millimeters a 10.15 10.45 0.400 0.411 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.50 0.90 0.020 0.035 g 1.27 bsc 0.050 bsc j 0.25 0.32 0.010 0.012 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 m b m 0.010 (0.25) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b p g 9x d 13x seating plane t s a m 0.010 (0.25) b s t 16 9 8 1 f j r x 45 m t s s 2.54 bsc 0.100 bsc t 3.81 bsc 0.150 bsc c k
1312 motorola analog ic device data case 762-01 plastic medium power package (sip-9) issue c 1 9 fn suffix case 775-02 plastic package (plcc-20) issue c 1 notes: 1. dimensioning and tolerancing per ansi y14.5, 1982. 2. controlling dimension: millimeter. 1 seating plane 9 u m a m 0.25 (0.010) t m a m 0.25 (0.010) t m c m 0.25 (0.010) t d 9 pl c a t e b k n m v s y r g f w q x j h dim min max min max inches millimeters a 22.40 23.00 0.873 0.897 b 6.40 6.60 0.252 0.260 c 3.45 3.65 0.135 1.143 d 0.40 0.55 0.015 0.021 e 9.35 9.60 0.368 0.377 f 1.40 1.60 0.055 0.062 g 2.54 bsc 0.100 bsc h 1.51 1.71 0.059 0.067 j 0.360 0.400 0.014 0.015 k 3.95 4.20 0.155 0.165 m 30 bsc 30 bsc n 2.50 2.70 0.099 0.106 q 3.15 3.45 0.124 0.135 r 13.60 13.90 0.535 0.547 s 1.65 1.95 0.064 0.076 u 22.00 22.20 0.866 0.874 v 0.55 0.75 0.021 0.029 w 2.89 bsc 0.113 bsc x 0.65 0.75 0.025 0.029 y 2.70 2.80 0.106 0.110 notes: 1. datums l, m, and n determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum t, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.250) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). m n l y brk w v d d s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t s lm s 0.010 (0.250) n s t x g1 b u z view dd 20 1 s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t s lm s 0.010 (0.250) n s t c g view s e j r z a 0.004 (0.100) t seating plane s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t h view s k k1 f g1 dim min max min max millimeters inches a 0.385 0.395 9.78 10.03 b 0.385 0.395 9.78 10.03 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 0.51 k 0.025 0.64 r 0.350 0.356 8.89 9.04 u 0.350 0.356 8.89 9.04 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y 0.020 0.50 z 2 10 2 10 g1 0.310 0.330 7.88 8.38 k1 0.040 1.02
1313 motorola analog ic device data fn suffix case 776-02 plastic package (plcc28) issue d 1 notes: 1. datums l, m, and n determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum t, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.250) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). n m l v w d d y brk 28 1 view s s lm s 0.010 (0.250) n s t s lm m 0.007 (0.180) n s t 0.004 (0.100) g1 g j c z r e a seating plane s lm m 0.007 (0.180) n s t t b s lm s 0.010 (0.250) n s t s lm m 0.007 (0.180) n s t u s lm m 0.007 (0.180) n s t z g1 x view dd s lm m 0.007 (0.180) n s t k1 view s h k f s lm m 0.007 (0.180) n s t dim min max min max millimeters inches a 0.485 0.495 12.32 12.57 b 0.485 0.495 12.32 12.57 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 0.51 k 0.025 0.64 r 0.450 0.456 11.43 11.58 u 0.450 0.456 11.43 11.58 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y 0.020 0.50 z 2 10 2 10 g1 0.410 0.430 10.42 10.92 k1 0.040 1.02
1314 motorola analog ic device data fn suffix case 777-02 plastic package (plcc) issue c m suffix case 803c preliminary plastic package 1 1 20 n l m d y d k v w 1 44 brk b z u x view dd s lm m 0.007(0.180) n s t s lm m 0.007(0.180) n s t g1 s lm s 0.010 (0.25) n s t k1 f h s lm m 0.007(0.180) n s t z g g1 r a e j view s c s lm m 0.007(0.180) n s t s lm m 0.007(0.180) n s t 0.004 (0.10) t seating plane view s s lm s 0.010 (0.25) n s t s lm m 0.007(0.180) n s t notes: 1. datums l, m, and n are determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum t, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.25) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. dim min max min max millimeters inches a 0.685 0.695 17.40 17.65 b 0.685 0.695 17.40 17.65 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 0.51 k 0.025 0.64 r 0.650 0.656 16.51 16.66 u 0.650 0.656 16.51 16.66 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y 0.020 0.50 z 2 10 2 10 g1 0.610 0.630 15.50 16.00 k1 0.040 1.02 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). dim a min max min max inches 12.35 12.80 0.486 0.504 millimeters b 5.10 5.45 0.201 0.215 c 1.95 2.05 0.077 0.081 d 0.35 0.50 0.014 0.020 e 0.81 0.032 f 12.40* 0.488* g 1.15 1.39 0.045 0.055 h 0.59 0.81 0.023 0.032 j 0.18 0.27 0.007 0.011 k 1.10 1.50 0.043 0.059 l 0.05 0.20 0.001 0.008 m 0 10 n 0.50 0.85 0.020 0.033 s 7.40 8.20 0.291 0.323 0 10 notes: 6 dimensioning and tolerancing per ansi y14.5m, 1982. 7 controlling dimension: millimeter. 8 dimensions a and b do not include mold protrusion. 9 maximum mold protrusion 0.15 (0.008) per side. 10 dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.006) total in excess of the d dimension at maximum material condition. *approximate a 0.13 (0.005) m tb ss 0.13 (0.005) m b m s 10 pl g d 20 pl l c 0.10 (0.004) seating plane k n j m e 1 20 11 10 a f b t
1315 motorola analog ic device data tv suffix case 821c-04 plastic package (15-pin zip) issue d 1 15 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension r does not include mold flash or protrusions. 4. dimension b does not include mold flash or protrusions. 5. mold flash or protrusions shall not exceed 0.010 (0.250). 6. dimension d does not include dambar protrusion. allowable protrusion shall be 0.003 (0.076) total in excess of the d dimension. at maximum material condition. dim min max min max millimeters inches a 0.684 0.694 17.374 17.627 b 0.784 0.792 19.914 20.116 c 0.173 0.181 4.395 4.597 d 0.024 0.031 0.610 0.787 e 0.058 0.062 1.473 1.574 g 0.050 bsc 1.270 bsc h 0.169 bsc 4.293 bsc j 0.018 0.024 0.458 0.609 k 0.700 0.710 17.780 18.034 l 0.200 bsc 5.080 bsc m 0.148 0.151 3.760 3.835 r 0.416 0.426 10.567 10.820 s 0.157 0.167 3.988 4.242 u 0.105 0.115 2.667 2.921 v 0.868 ref 22.047 ref y 0.625 0.639 15.875 16.231 b d u pin 15 15x g r a pin 1 m q p p m 0.010 (0.254) q s t j 15x m 0.024 (0.610) t k l h s v e c y t seating plane t suffix case 821d-03 plastic package issue c notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension r does not include mold flash or protrusions. 4. dimension b does not include mold flash or protrusions. 5. mold flash or protrusions shall not exceed 0.010 (0.250). 6. deleted 7. dimension d does not include dambar protrusion. allowable protrusion shall be 0.003 (0.076) total in excess of the d dimension. at maximum material condition. dim min max min max millimeters inches a 0.681 0.694 17.298 17.627 b 0.784 0.792 19.914 20.116 c 0.173 0.181 4.395 4.597 d 0.024 0.031 0.610 0.787 e 0.058 0.062 1.473 1.574 f g 0.050 bsc 1.270 bsc h 0.110 bsc 0.407 0.584 j 0.018 0.024 0.458 0.609 k q 0.148 0.151 3.760 3.835 r 0.416 0.426 10.567 10.820 u 0.110 bsc 2.794 bsc y 0.503 ref 12.776 ref b d u pin 15 15x g r a pin 1 q l p p m 0.010 (0.254) l s t j 15x m 0.024 (0.610) t k h e c y t seating plane f 7x 0.016 0.023 1.078 1.086 2.794 bsc 27.382 27.584 1 15
1316 motorola analog ic device data ftb suffix case 824d01 plastic package (tqfp44) issue o 1 ???? ???? notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u and z to be determined at datum plane ab. 5. dimensions s and v to be determined at seating plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.530 (0.021). 44 1 34 33 11 12 22 23 detail aa z t a s tu m 0.20 (0.008) z s ab 0.05 (0.002) tu s b v u m y e h c ab detail ad 0.10 (0.004) k w x view ad t, u, z f n section aeae j d base metal plating ae ae g 0.05 (0.002) z detail aa dim min max min max inches millimeters a 9.950 10.050 0.392 0.396 b 9.950 10.050 0.392 0.396 c 1.400 1.600 0.055 0.063 d 0.300 0.450 0.012 0.018 e 1.350 1.450 0.053 0.057 f 0.300 0.400 0.012 0.016 g 0.800 bsc 0.031 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.450 0.550 0.018 0.022 l 8.000 bsc 0.315 bsc m 12 ref 12 ref n 0.090 0.160 0.004 0.006 q 1 5 1 5 r 0.100 0.200 0.004 0.008 s 11.900 12.100 0.469 0.476 v 11.900 12.100 0.469 0.476 w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref y 12 ref 12 ref l l s tu m 0.20 (0.008) z s ac s tu m 0.20 (0.008) z s ab s tu m 0.20 (0.008) z s ac ac q s tu m 0.20 (0.008) z s ac r
1317 motorola analog ic device data fb suffix case 824e02 plastic package (qfp) issue a ??? ??? 44 1 34 33 11 12 22 23 view y n l a s lm m 0.20 (0.008) n s h s lm m 0.20 (0.008) n s t 0.05 (0.002) lm s b v m t m y e w c h datum plane view p 0.01 (0.004) h datum plane r2 k a1 c1 view p dim min max min max inches millimeters a 9.90 10.10 0.390 0.398 b 9.90 10.10 0.390 0.398 c 2.00 2.21 0.079 0.087 d 0.30 0.45 0.0118 0.0177 e 2.00 2.10 0.079 0.083 f 0.30 0.40 0.012 0.016 g 0.80 bsc 0.031 bsc j 0.13 0.23 0.005 0.009 k 0.65 0.95 0.026 0.037 m 5 10 5 10 s 12.95 13.45 0.510 0.530 v 12.95 13.45 0.510 0.530 w 0.000 0.210 0.000 0.008 y 5 10 5 10 a1 0.450 ref 0.170 0.018 ref 0.007 b1 l, m, n s lm m 0.20 (0.008) n s t f b1 section j1j1 j d base metal g 40x r r1 r 1 2 plating 44 pl j1 j1 g c1 1.600 ref 0.063 ref r1 r2 5 10 5 10 1 2 0.130 0.005 0.130 0.300 0.005 0.012 0.130 0.300 0.005 0.012 0 7 0 7 pin 1 ident s lm m 0.20 (0.008) n s h 0.05 (0.002) n s lm m 0.20 (0.008) n s t view y 3 pl notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums l, m and n to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane t. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane h. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.530 (0.021). 1 44
1318 motorola analog ic device data fb suffix case 840f01 plastic package issue o ?? ?? ?? ?? 0.20 (0.008) ac m z tu s s 0.20 (0.008) ab m z tu s s 0.20 (0.008) ac m z tu s s 0.20 (0.008) ab m z tu s s 0.20 (0.008) ac m z tu s s z 0.050 (0.002) 0.050 (0.002) tu z u t l detail aa l 1 64 49 48 16 33 17 32 a s b v 0.10 (0.004) ab e h c y m detail ad ac r detail ad w k x q j d n base section aeae f metal detail aa g ae ae p t, u, z notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u and z to be determined at datum plane ac. 5. dimensions s and v to be determined at seating plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010 ) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). dim a min max min max inches 9.950 10.050 0.392 0.396 millimeters b 9.950 10.050 0.392 0.396 c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.500 bsc 0.020 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.450 0.550 0.018 0.022 l m n 0.090 0.160 0.004 0.006 p q 1 5 r 0.100 0.200 0.004 0.008 s 11.900 12.100 0.469 0.476 v 11.900 12.100 0.469 0.476 w x y 1.000 ref 12 ref 0.200 ref 0.039 ref 0.008 ref 0.010 bsc 0.250 bsc 7.500 bsc 0.295 bsc 5 12 ref 5 12 ref 5 12 ref 5 5 1 5 5 5 5 1 64
1319 motorola analog ic device data dm suffix case 846a02 plastic package (micro8) issue c 1 s b m 0.08 (0.003) a s t dim min max min max inches millimeters a 2.90 3.10 0.114 0.122 b 2.90 3.10 0.114 0.122 c 1.10 0.043 d 0.25 0.40 0.010 0.016 g 0.65 bsc 0.026 bsc h 0.05 0.15 0.002 0.006 j 0.13 0.23 0.005 0.009 k 4.75 5.05 0.187 0.199 l 0.40 0.70 0.016 0.028 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. b a d k g pin 1 id 8 pl 0.038 (0.0015) t seating plane c h j l 8
1320 motorola analog ic device data fb suffix case 848b-04 plastic package (tqfp52) issue c 1 52 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums a, b and d to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane c. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane h. 7. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the d dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. detail a l 39 40 26 27 1 52 14 13 l a b v s ab m 0.20 (0.008) d s h ab 0.05 (0.002) s ab m 0.20 (0.008) d s c d b v b s ab m 0.20 (0.008) d s h ab 0.05 (0.002) s ab m 0.20 (0.008) d s c h 0.10 (0.004) c seating plane datum plane m g h e c m detail c u q x w k t r detail c dim min max min max inches millimeters a 9.90 10.10 0.390 0.398 b 9.90 10.10 0.390 0.398 c 2.10 2.45 0.083 0.096 d 0.22 0.38 0.009 0.015 e 2.00 2.10 0.079 0.083 f 0.22 0.33 0.009 0.013 g 0.65 bsc 0.026 bsc h 0.25 0.010 j 0.13 0.23 0.005 0.009 k 0.65 0.95 0.026 0.037 l 7.80 ref 0.307 ref m 5 10 5 10 n 0.13 0.17 0.005 0.007 q 0 7 0 7 r 0.13 0.30 0.005 0.012 s 12.95 13.45 0.510 0.530 t 0.13 0.005 u 0 0 v 12.95 13.45 0.510 0.530 w 0.35 0.45 0.014 0.018 x 1.6 ref 0.063 ref b b detail a a, b, d jn d f base metal section bb s ab m 0.02 (0.008) d s c
1321 motorola analog ic device data fb suffix case 848d03 plastic package issue c f notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums l, m and n to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane t. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane -h-. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the lead width to exceed 0.46 (0.018). minimum space between protrusion and adjacent lead or protrusion 0.07 (0.003). ??? ??? view aa view aa 2 x r r1 ab ab view y section abab rotated 90 clockwise dim a min max min max inches 10.00 bsc 0.394 bsc millimeters a1 5.00 bsc 0.197 bsc b 10.00 bsc 0.394 bsc b1 5.00 bsc 0.197 bsc c 1.70 0.067 c1 0.05 0.20 0.002 0.008 c2 1.30 1.50 0.051 0.059 d 0.20 0.40 0.008 0.016 e 0.45 0.030 f 0.22 0.35 0.009 0.014 g 0.65 bsc 0.75 0.018 0.026 bsc j 0.07 0.20 0.003 0.008 k 0.50 ref 0.020 ref r1 0.08 0.20 0.003 0.008 s 12.00 bsc 0.472 bsc s1 6.00 bsc 0.236 bsc u 0.09 0.16 0.004 0.006 v 12.00 bsc 0.472 bsc v1 6.00 bsc 0.236 bsc w 0.20 ref 0.008 ref z 1.00 ref 0.039 ref c l x x=l, m, n 1 13 14 26 27 39 40 52 4x tips 4x n 0.20 (0.008) h lm n 0.20 (0.008) t lm 3x view y seating plane c 0.10 (0.004) t 4x q 3 4x q 2 s 0.05 (0.002) 0.25 (0.010) gage plane c2 c1 w k e z s lm m 0.13 (0.005) n s t plating base metal d j u b v b1 a s v1 a1 s1 l n m h t q 1 q g q 1 q q 3 q 2 07 12 513 07 0 0 ref 12 ref 13 5 52 1
1322 motorola analog ic device data b suffix case 85901 plastic package (sdip) issue o 56 1 a b t 56 29 128 seating plane j 56 pl d 56 pl s a m 0.25 (0.010) t n f g e s b m 0.25 (0.010) t k c h l m dim min max min max millimeters inches a 2.035 2.065 51.69 52.45 b 0.540 0.560 13.72 14.22 c 0.155 0.200 3.94 5.08 d 0.014 0.022 0.36 0.56 e 0.035 bsc 0.89 bsc f 0.032 0.046 0.81 1.17 g 0.070 bsc 1.778 bsc h 0.300 bsc 7.62 bsc j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.600 bsc 15.24 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.02 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimensions a and b do not include mold flash. maximum mold flash 0.25 (0.010) b suffix case 85801 plastic package issue o a 121 42 22 b seating plane t s a m 0.25 (0.010) t s b m 0.25 (0.010) t l h m j 42 pl d 42 pl f g n k c notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimensions a and b do not include mold flash. maximum mold flash 0.25 (0.010). dim min max min max millimeters inches a 1.435 1.465 36.45 37.21 b 0.540 0.560 13.72 14.22 c 0.155 0.200 3.94 5.08 d 0.014 0.022 0.36 0.56 f 0.032 0.046 0.81 1.17 g 0.070 bsc 1.778 bsc h 0.300 bsc 7.62 bsc j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.600 bsc 15.24 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.02 42 1
1323 motorola analog ic device data fb, ftb suffix case 873-01 plastic package (tqfp32) issue a 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums a, b and d to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane c. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane h. 7. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the d dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. u b l detail a l a 32 25 24 16 17 18 9 v s ab m 0.20 (0.008) d s c s ab m 0.20 (0.008) d s h ab 0.05 (0.002) s ab m 0.20 (0.008) d s c ab 0.05 (0.002) s ab m 0.20 (0.008) d s h d a s b c seating plane h datum plane m g detail c m h c e 0.01 (0.004) h datum plane t detail c r k q x detail a b b p a, b, d s ab m 0.20 (0.008) d s c j f n d section bb base metal view rotated 90 clockwise dim min max min max inches millimeters a 6.95 0.274 0.280 b 6.95 7.10 0.274 0.280 c 1.40 1.60 0.055 0.063 d 0.273 0.373 0.010 0.015 e 1.30 1.50 0.051 0.059 f 0.273 0.010 g 0.80 bsc 0.031 bsc h 0.20 0.008 j 0.119 0.197 0.005 0.008 k 0.33 0.57 0.013 0.022 l 5.6 ref 0.220 ref m 6 8 6 8 n 0.119 0.135 0.005 0.005 p 0.40 bsc 0.016 bsc q 5 10 5 10 r 0.15 0.25 0.006 0.010 s 8.85 9.15 0.348 0.360 t 0.15 0.25 0.006 0.010 u 5 11 5 11 v 8.85 9.15 0.348 0.360 x 1.00 ref 0.039 ref 7.10
1324 motorola analog ic device data t suffix case 894-03 plastic package (23-pin szip) issue b 1 23 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension r does not include mold flash or protrusions. 4. dimension b does not include mold flash or protrusions. 5. mold flash or protrusions shall not exceed 0.010 (0.250). 6. dimension d does not include dambar protrusion. allowable protrusion shall be 0.003 (0.076) total in excess of the d dimension at maximum material condition. dim a min max min max millimeters 0.684 0.694 17.374 17.627 inches b 1.183 1.193 30.048 30.302 c 0.175 0.179 4.445 4.547 d 0.026 0.031 0.660 0.787 e 0.058 0.062 1.473 1.574 f 0.165 0.175 4.191 4.445 g 0.050 bsc 1.270 bsc h 0.169 bsc 4.293 bsc j 0.014 0.020 0.356 0.508 k 0.625 0.639 15.875 16.231 l 0.770 0.790 19.558 20.066 m 0.148 0.152 3.760 3.861 n 0.148 0.152 3.760 3.861 p 0.390 bsc 9.906 bsc r 0.416 0.424 10.566 10.770 s 0.157 0.167 3.988 4.242 u 0.105 0.115 2.667 2.921 v 0.868 ref 22.047 ref w 0.200 bsc 5.080 bsc y 0.700 0.710 17.780 18.034 pin 1 d n m a p l b f u r g pin 23 23x s q m 0.010 (0.254) n s t y k v h s e c w m 0.024 (0.610) t j 23x t seating plane
1325 motorola analog ic device data fta suffix case 93202 plastic package (tqfp48) issue d dim a min max min max inches 7.000 bsc 0.276 bsc millimeters a1 3.500 bsc 0.138 bsc b 7.000 bsc 0.276 bsc b1 3.500 bsc 0.138 bsc c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.500 basic 0.020 basic h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.500 0.700 0.020 0.028 m 12 ref 12 ref n 0.090 0.160 0.004 0.006 p 0.250 basic 0.010 basic q 1 5 1 5 r 0.150 0.250 0.006 0.010 s 9.000 bsc 0.354 bsc s1 4.500 bsc 0.177 bsc v 9.000 bsc 0.354 bsc v1 4.500 bsc 0.177 bsc w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u, and z to be determined at datum plane ab. 5. dimensions s and v to be determined at seating plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.250 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). 8. minimum solder plate thickness shall be 0.0076 (0.0003). 9. exact shape of each corner is optional. ??? ??? ??? a a1 t z 0.200 (0.008) ab tu u 4x z 0.200 (0.008) ac tu 4x b b1 1 12 13 24 25 36 37 48 z s1 s v v1 p ae ae t, u, z detail y detail y base metal n j f d s tu m 0.080 (0.003) z s ac section aeae ab ac ad g 0.080 (0.003) ac m top & bottom q w k x e c h 0.250 (0.010) gauge plane r 9 detail ad 48 1
1326 motorola analog ic device data d2t suffix case 93603 plastic package issue b d2t suffix case 936a02 plastic package (d 2 pak) issue a v u terminal 4 a 12 3 k f b j s h d g c m 0.010 (0.254) t e m l p n r t optional chamfer 5 ref a 123 k b s h d g c e m l p n r v u terminal 6 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. tab contour optional within dimensions a and k. 4. dimensions u and v establish a minimum mounting surface for terminal 6. 5. dimensions a and b do not include mold flash or gate protrusions. mold flash and gate protrusions not to exceed 0.025 (0.635) maximum. dim a min max min max millimeters 0.386 0.403 9.804 10.236 inches b 0.356 0.368 9.042 9.347 c 0.170 0.180 4.318 4.572 d 0.026 0.036 0.660 0.914 e 0.045 0.055 1.143 1.397 g 0.067 bsc 1.702 bsc h 0.539 0.579 13.691 14.707 k 0.050 ref 1.270 ref l 0.000 0.010 0.000 0.254 m 0.088 0.102 2.235 2.591 n 0.018 0.026 0.457 0.660 p 0.058 0.078 1.473 1.981 r 5 ref s 0.116 ref 2.946 ref u 0.200 min 5.080 min v 0.250 min 6.350 min 45 m 0.010 (0.254) t t optional chamfer 5 ref 5 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. tab contour optional within dimensions a and k. 4. dimensions u and v establish a minimum mounting surface for terminal 4. 5. dimensions a and b do not include mold flash or gate protrusions. mold flash and gate protrusions not to exceed 0.025 (0.635) maximum. dim a min max min max millimeters 0.386 0.403 9.804 10.236 inches b 0.356 0.368 9.042 9.347 c 0.170 0.180 4.318 4.572 d 0.026 0.036 0.660 0.914 e 0.045 0.055 1.143 1.397 f 0.051 ref 1.295 ref g 0.100 bsc 2.540 bsc h 0.539 0.579 13.691 14.707 j 0.125 max 3.175 max k 0.050 ref 1.270 ref l 0.000 0.010 0.000 0.254 m 0.088 0.102 2.235 2.591 n 0.018 0.026 0.457 0.660 p 0.058 0.078 1.473 1.981 r s 0.116 ref 2.946 ref u 0.200 min 5.080 min v 0.250 min 6.350 min 1 2 3 1 5
1327 motorola analog ic device data dt, dtb suffix case 948e02 plastic package (tssop20) issue a dtb suffix case 948f01 plastic package (tssop16, tssop16l) issue o dim a min max min max inches 6.60 0.260 millimeters b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.27 0.37 0.011 0.015 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 1 10 11 20 pin 1 ident a b t 0.100 (0.004) c d g h section nn k k1 jj1 n n m f w seating plane v u s u m 0.10 (0.004) v s t 20x ref k l l/2 2x s u 0.15 (0.006) t detail e 0.25 (0.010) detail e 6.40 0.252 s u 0.15 (0.006) t ??? ??? ??? dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.18 0.28 0.007 0.011 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane w. section nn seating plane ident. pin 1 1 8 16 9 detail e j j1 b c d a k k1 h g detail e f m l 2x l/2 u s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) t v w 0.25 (0.010) 16x ref k n n notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane w. 1 20 1 16
1328 motorola analog ic device data dtb suffix case 948g01 plastic package (tssop14) issue o 1 14 dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4 dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5 dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6 terminal numbers are shown for reference only. 7 dimension a and b are to be determined at datum plane w. s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l u seating plane 0.10 (0.004) t ??? ??? section nn detail e j j1 k k1 detail e f m w 0.25 (0.010) 8 14 7 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t v 14x ref k n n
1329 motorola analog ic device data dtb suffix case 948h01 plastic package issue o dim min max min max inches millimeters a 7.70 7.90 0.303 0.311 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.27 0.37 0.011 0.015 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane w. s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l u seating plane 0.10 (0.004) t ??? ??? section nn detail e j j1 k k1 detail e f m w 0.25 (0.010) 13 24 12 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t v 24x ref k n n 1 24
1330 motorola analog ic device data dtb suffix case 948j01 plastic package (tssop8) issue o 1 8 ??? ??? dim min max min max inches millimeters a 2.90 3.10 0.114 0.122 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4 dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5 dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6 terminal numbers are shown for reference only. 7 dimension a and b are to be determined at datum plane w. section nn seating plane ident. pin 1 1 4 8 5 see detail e j j1 b c d a k k1 h g detail e f m l 2x l/2 u s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) t v w 0.25 (0.010) 8x ref k n n m suffix case 96701 plastic package (eiaj20) issue o dim min max min max inches 2.05 0.081 millimeters 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.18 0.27 0.007 0.011 12.35 12.80 0.486 0.504 5.10 5.45 0.201 0.215 1.27 bsc 0.050 bsc 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0 0.70 0.90 0.028 0.035 0.81 0.032 a 1 h e q 1 l e 10 0 10 notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimensions d and e do not include mold flash or protrusions and are measured at the parting line. mold flash or protrusions shall not exceed 0.15 (0.006) per side. 4 terminal numbers are shown for reference only. 5 the lead width dimension (b) does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the lead width dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. minimum space between protrusions and adjacent lead to be 0.46 ( 0.018). h e a 1 l e q 1 c a z d e 20 110 11 b m 0.13 (0.005) e 0.10 (0.004) view p detail p m l a b c d e e l m z 1 20
1331 motorola analog ic device data ftb suffix case 97601 plastic package (tqfp20) issue o dim min max min max inches millimeters a 4.000 bsc 0.157 bsc a1 2.000 bsc 0.079 bsc b 4.000 bsc 0.157 bsc b1 2.000 bsc 0.079 bsc c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.650 bsc 0.026 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.500 0.700 0.020 0.028 m 12 ref 12 ref n 0.090 0.160 0.004 0.006 p 0.250 bsc 0.010 bsc q 1 5 1 5 r 0.150 0.250 0.006 0.010 s 6.000 bsc 0.236 bsc s1 3.000 bsc 0.118 bsc v 6.000 bsc 0.236 bsc v1 3.000 bsc 0.118 bsc w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u, and z to be determined at datum plane ab. 5. dimensions s and v to be determined at datum plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.250 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). 8. minimum solder plate thickness shall be 0.0076 (0.0003). 9. exact shape of each corner is optional. detail ad detail y 4x 4x 1 5 6 11 16 10 15 20 s s1 a a1 u tu 0.200 (0.008) z ab 9 b b1 t v v1 z tu 0.200 (0.008) z ab ac ab 0.080 (0.003) ac r detail ad detail y ae ae k x w g top & bottom section aeae m q ce h 0.250 (0.010) gauge plane ???? ???? ???? f d n j t, u, z s tu s 0.080 (0.003) z s ac 1 20
1332 motorola analog ic device data fta suffix case 97701 plastic package issue o dim min max min max inches millimeters a 4.000 bsc 0.157 bsc a1 2.000 bsc 0.079 bsc b 4.000 bsc 0.157 bsc b1 2.000 bsc 0.079 bsc c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.500 bsc 0.020 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.500 0.700 0.020 0.028 m 12 ref 12 ref n 0.090 0.160 0.004 0.006 p 0.250 bsc 0.010 bsc q 1 5 1 5 r 0.150 0.250 0.006 0.010 s 6.000 bsc 0.236 bsc s1 3.000 bsc 0.118 bsc v 6.000 bsc 0.236 bsc v1 3.000 bsc 0.118 bsc w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u, and z to be determined at datum plane ab. 5. dimensions s and v to be determined at datum plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.250 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). 8. minimum solder plate thickness shall be 0.0076 (0.0003). 9. exact shape of each corner is optional. detail ad detail y 4x 4x 1 6 7 13 19 12 18 24 s s1 a a1 u tu 0.200 (0.008) z ab 9 b b1 t v v1 z tu 0.200 (0.008) z ab ac ab 0.080 (0.003) ac r detail ad detail y ae ae k x w g top & bottom section aeae m q ce h 0.250 (0.010) gauge plane ???? ???? ???? f d n j t, u, z p s tu s 0.080 (0.003) z s ac 1 24
1333 motorola analog ic device data n suffix case 121201 plastic package (sot23) issue o 1 dim min max millimeters a1 0.00 0.10 a2 1.00 1.30 b 0.30 0.50 c 0.10 0.25 d 2.80 3.00 e 2.50 3.10 e1 1.50 1.80 e 0.95 bsc e1 1.90 bsc l l1 0.45 0.75 notes: 1. dimensions are in millimeters. 2. interpret dimensions and tolerances per asme y14.5m, 1994. 3. datum c is a seating plane. a 1 5 23 4 d e1 b l1 e e e1 c m 0.10 c s b s a b 5x a2 a1 s 0.05 c l 0.20 h suffix case 121301 plastic package (sot89) issue o 1 dim min max millimeters a2 1.40 1.60 b 0.37 0.57 b1 0.32 0.52 c 0.30 0.50 d 4.40 4.60 d1 1.50 1.70 e 4.25 e1 2.40 2.60 e 1.50 bsc e1 3.00 bsc l1 0.80 notes: 1. dimensions are in millimeters. 2. interpret dimensions and tolerancing per asme y14.5m, 1994. 3. datum c is a seating plane. a d e1 b l1 e d1 e e1 c m 0.10 c s b s a m 0.10 c s b s a b b1 2x a2 c

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